SLIP 2016 TOC

A Comparative Analysis of Front-End and Back-End Compatible Silicon Photonic On-Chip
Interconnects

  • Thakkar
    Ishan G.

Photonic devices fabricated with back-end compatible silicon photonic (BCSP) materials
can provide independence from the complex CMOS front-end compatible silicon photonic
(FCSP) process, to significantly enhance photonic network-on-chip (PNoC) …

Latch Clustering for Minimizing Detection-to-Boosting Latency Toward Low-Power Resilient
Circuits

  • Hsu
    Chih-Cheng

Dynamic voltage scaling (DVS) has become one of the most effective approaches to achieve
ultra-low-power SoC. To eliminate timing errors arising from DVS, several error-resilient
circuit design techniques were proposed to detect and/or correct timing …

Connectivity Effects on Energy and Area for Neuromorphic System with High Speed Asynchronous
Pulse Mode Links

  • Segal
    Carrie

Hardware neuromorphic systems are challenged to achieve biologically realistic levels
of interconnectivity. When building a physical implementation of a neural net, the
properties of the media immediately impose limits on the number of interconnects and

Buffered Interconnects in 3D IC Layout Design

  • Ahmed
    Mohammad A.

A very important challenge in designing through-silicon via (TSV)-based 3D ICs is
to accurately estimate, through all stages of the physical design, the interconnect
delay which is strongly dependent on the layout of 3D IC. The earlier in the design

Topologically-Geometric Routing

  • Bazylevych
    Roman

The paper introduces foundations of the “Flexible Routing Method” that belongs to
the topologically-geometric type. It develops the idea to divide the routing problem
on two separate successive stages: topological and geometrical. At the first stage
it …

Revisiting 3DIC Benefit with Multiple Tiers

  • Chan
    Wei-Ting Jonas

3DICs with multiple tiers are expected to achieve large benefits (e.g., in terms of
power, area) as compared to conventional planar designs. However, few if any previous
works study upper bounds on power and area benefits from 3DIC integration with …

Spin-Hall Assisted STT-RAM Design and Discussion

  • Eken
    Enes

In recent years, Spin-Transfer Torque Random Access Memory (STT-RAM) has attracted
significant attentions from both industry and academia due to its attractive attributes
such as small cell area and non-volatility. However, long switching time and large

A Demand-Aware Predictive Dynamic Bandwidth Allocation Mechanism for Wireless Network-on-Chip

  • Mansoor
    Naseef

Long distance data communication over multi-hop wireline paths in conventional Networks-on-Chips
(NoCs) cause high energy consumption and degradation in bandwidth. Wireless interconnects
in the millimeter-wave band have emerged as an energy-efficient …


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