===============================================================================
 SIGDA -- The Resource for EDA Professionals     http://www.sigda.org

 This newsletter is a free service for current SIGDA members
 and is added automatically with a new SIGDA membership.
 Circulation: 2,700
===============================================================================

   1  November 2007       ACM/SIGDA E-NEWSLETTER       Vol. 37, No. 21

   Online archive: http://www.sigda.org/newsletter
===============================================================================

Contents of this E-NEWSLETTER:

(1) Letter From the Chair
      From: Diana Marculescu 

(2) SIGDA News
      Contributing author: Tony Givargis 
      Contributing author: Michael Orshansky 
      Contributing author: Marc Riedel 

(3) What is multithreading and multi-core?
      Author: Kevin D. Kissell 

(4) Paper Submission Deadlines
      From: Hai Zhou 

(5) Upcoming Symposia, Conferences and Workshops
      From: Hai Zhou 

(6) Upcoming Funding Opportunities
      From: Qinru Qiu 

(7) Call For Participation: Annual ACM/SIGDA Dinner
    with Invited Speaker SIGDA Pioneer Achievement Awardee, Gene Amdahl
      From: Diana Marculescu 

(8) Call For Papers: Tau Workshop 2008
      From: Frank Liu 

(9) Call For Submissions: ASP-DAC 2008 Student Forum
      From: Naehyuck Chang 

(10) Call For Papers: SBCCI 2008
      From: Ricardo Reis 

===============================================================================

Dear ACM/SIGDA members,

  In this issue, we have included a letter from ACM/SIGDA chair. The "What is
..." column from previous newsletter has been reprinted. In addition, "SIGDA
News" column contains a number of fresh headlines. We have also updated the
contents of other regular columns.

  As always, we welcome your comments and suggestions. If you would like to
participate or contribute to the content of the E-Newsletter, please feel free
to contact any of us.

Qing Wu, E-Newsletter Editor;
Matthew Guthaus, E-Newsletter Associate Editor;
Tony Givargis, E-Newsletter Associate Editor;
Michael Orshansky, E-Newsletter Associate Editor;
Marc Riedel, E-Newsletter Associate Editor;
Qinru Qiu, E-Newsletter Associate Editor;
Hai Zhou, E-Newsletter Associate Editor;

===============================================================================

Dear SIGDA Members,

It is my pleasure to invite you all at the SIGDA Pioneer Achievement Award
Dinner at ICCAD, on Tuesday, November 6, 7:30pm at the DoubleTree Hotel in Dan
Jose. The annual ACM/SIGDA Dinner/Member Meeting at ICCAD will feature the
presentation of the Pioneering Achievement Award to Dr. Gene Amdahl, on the
40th anniversary of Amdahl's Law. Dr. Amdahl will be the featured speaker,
discussing the history of the Law and his career in the computer industry. The
meeting and dinner are open to the public. Dr. Amdahl's talk will be followed
by a panel debate on the future of multi-core CPUs and parallel processing
featuring Gene Amdahl, Arvind, John L. Gustafson, Patrick H. Madden, Kunle
Olukotun, Gary Smith, and moderated by Richard Goering. Amdahl's Law predicts
that performance gains will diminish rapidly as the number of cores grows.
Faced with this dilemma, the question considered by the panelists is "Can We
still Keep the Faith?" - please join us at this exciting event.

Finally, just a few updates on what happens in the SIGDA Board and SIGDA
Newsletter Editorial Board. Just before DAC'07, Igor Markov (U. Michigan)
has been appointed as a SIGDA Executive Committee Member at Large, replacing
the vacancy created by Rich Auletta (Cadence). One of our Newsletter
Associate Editors, Michael Orshansky (UT Austin) has stepped down to become
a co-chair of the new SIGDA Technical Committee on Design for Manufacturing
together with Frank Liu (IBM). We welcome them both along with the new SIGDA
Newsletter Associate Editor, Lin Yuan (Synopsys).

With the end of the year fast approaching, many of you may need to renew
your ACM/SIGDA membership. If you would like to continue receiving the many
benefits of being a SIGDA member - including this Newsletter - don't forget
to renew your membership.

Diana Marculescu
ACM/SIGDA Chair


===============================================================================

SIGDA News
-----------------------

"UC Riverside Research Leads to Self-Improving Chips with Speed 'Warping'"
http://www.hpcwire.com/hpc/1842445.html
A new, patent-pending technology developed over the last five years by UCR's
Frank Vahid, Professor of Computer Science and Engineering, called "Warp
processing" gives a computer chip the ability to improve its performance over
time. The benefits of Warp processing are just being discovered by the
computing industry. A range of companies including IBM, Intel and Motorola's
Freescale have already pursued licenses for the technology through UCR's
funding source, the Semiconductor Research Corporation. Here's how Warp
processing works: When a program first runs on a microprocessor chip (such as
a
Pentium), the chip monitors the program to detect its most frequently-executed
parts. The microprocessor then automatically tries to move those parts to a
special kind of chip called a field-programmable gate array, or FPGA. "An FPGA
can execute some (but not all) programs much faster than a microprocessor --
10
times, 100 times, even 1,000 times faster," explains Vahid.

"Under the Hood: Uncovering hidden chip costs"
http://www.eetimes.com/news/design/showArticle.jhtml?articleID=202402983
The proportion of semiconductor content is increasing in almost everything we
own. For some large manufacturers of consumer electronics, semiconductors are
the single largest contributor to finished-goods costs. A clear understanding
of the chip supplier's cost structures can bolster the OEM's negotiating
position.

"Viewpoint: RTL-ers Should Move to ESL"
http://www.eetimes.com/news/design/showArticle.jhtml?articleID=202404805
Fifteen years ago, designers were buzzing about a new design approach:
Register
Transfer Level (RTL) Design. There was a fundamental change underway in how
chip designs were created and implemented. There were methodology experts
within electronics companies whose sole responsibility was to move design
teams
to using RTL design methods. It was this focus that enabled the methodology
shift the industry experienced and changed the way chips were designed.

"Big EDA Firms Not Prepared to Drive 3D Integration, Says Panel"
http://www.eetimes.com/news/design/showArticle.jhtml?articleID=202404243
European research organization IMEC is putting a renewed emphasis on chip
packaging . and on 3D-integration in particular . according to plans emerging
at a press briefing ahead of its Annual Research Review Meeting. However, IMEC
and European chip company experts are not expecting much help to come from the
"big three" EDA companies . usually taken to mean Cadence Design Systems Inc.,
Mentor Graphics Corp. and Synopsys Inc.

"Researchers Propose New Design Technique"
http://www.eetimes.com/news/semi/showArticle.jhtml?articleID=202600806
Researchers from the Indian Institute of Technology together with another
institute in Kolkata have proposed a layout-aware, coverage-driven technique
for Illinois Scan Architecture (ILS) used to cut test application time and
test
data volume in high-density circuits.

"FPGA Debugger Works at Full Speed"
http://www.eetimes.com/news/design/showArticle.jhtml?articleID=202601077
EDA startup EDAptability has announced the availability of its FPGA and ASIC
debugging tool TotalScope. With a combination of RTL level elaboration, model
extraction and modification techniques with simulation, the tool offers
unrivaled signal visibility, the company claims.

"Consumer Electronics Drives the Electronic Design Automation (EDA) Industry
Spurring the Need for Innovation"
http://home.businesswire.com/portal/site/google/index.jsp?ndmViewId=news_view&newsId=20071023005900&newsLang=en
Who are the customers for EDA vendors in Europe? In 2006 Europe accounted for
16% of global semiconductor revenue or .31 billion. Europe is home to the
following four major semiconductor companies: STMicroelectronics in Geneva,
Switzerland, Qimonda and Infineon in Munich, Germany, and NXP in Eindhoven,
the
Netherlands. NXP was formerly a division of Philips but was spun out in 2006.
Qimonda, a supplier of DRAM products, was carved out of Infineon Technologies
in 2006 and went public in August 2006. All four are ranked by revenue among
the top 15 semiconductor companies in the world. In addition there are around
150 fabless semiconductor companies in Europe as well as hundreds of system
design houses.

"SC07 Panels: From Quantum Computing to Exotic Architectures"
http://www.hpcwire.com/hpc/1828030.html
How does one celebrate the 50th birthday of the most popular programming
language in supercomputing? Industry experts in high performance computing,
communications and storage technologies will explore this question and others
in a handful of select panels at SC07 in Reno, Nev., Nov. 10-16, 2007.
Sponsored by ACM and the IEEE Computer Society, SC07 showcases the latest
advances in high performance computing, networking, storage and analysis. The
SC07 panels program has assembled a stellar list of industry experts from
various disciplines to offer diverse points of view on many exciting topics
that are both relevant and timely in today's world of supercomputing.

"Synbio - Is It Something Dramatically Different?"
http://www.sciencebusiness.net/wordpress/2007/10/23/synbio-is-it-something-dramatically-different/
It has taken a book-promoting trip to Europe by J. Craig Venter, the genial
and
indefatigable researcher into the human genome, to alert me to synbio.
Synthetic biology is seen by some as such a menace to our future as to justify
the acopalyptic assessment of 2003 by Sir Martin Rees, president of Britain.s
Royal Society, that mankind has only a 50% chance of escaping extinction by
2100. Others of a decidedly more optimistic frame of mind see it as offering
bargain-price solutions to problems as varied as malaria and our need to
defeat
climate change by extracting carbon dioxide from the atmosphere.

"Samsung Intros 64-Gbit MLC NAND Chip"
http://www.edn.com/article/CA6493619.html?industryid=47037
South Korea-based semiconductor technology giant Samsung Electronics Co. Ltd.
today announced that it has developed what it claims is the world's first
64-Gbit multi level cell (MLC) NAND flash memory chip, using 30-nm process
technology (wafer pictured below).

"IBM, MediaTek to Jointly Develop Ultra-Fast Wireless Chipsets"
http://www.edn.com/article/CA6493152.html?industryid=47037
Bringing together tech giants from the U.S. and Asia, Armonk, N.Y.-based IBM
Corp. and Taiwan-based fabless design company MediaTek Inc.  today launched a
joint initiative to develop ultra fast chipsets that can wirelessly transmit a
full-length high definition movie to and from a home PC, hand-held device,
retail kiosk or television set.

"Elpida, UMC Develop Copper Low-k DRAM, PRAM"
http://www.edn.com/article/CA6493166.html?industryid=47037
Tokyo-based DRAM manufacturer Elpida Memory Inc. and Hsinchu, Taiwan-based
semiconductor foundry United Microelectronics Corp. (UMC) announced a joint
development program for advanced DRAM with copper low-k backend, as well as
for
phase-change random access memory (PRAM).

"SEMI: North America Equipment Book-to-bill Dips Further"
http://www.edn.com/article/CA6492769.html?industryid=47037
The contraction of the semiconductor manufacturing equipment market is
continuing as evidenced by North American-based manufacturers of semiconductor
equipment posting $1.23 billion in orders in September and a book-to-bill
ratio
of 0.81 according to the September book-to-bill report from the SEMI industry
organization.

"Surge in NAND Usage Signals Sea Change for Memory Market"
http://www.edn.com/article/CA6492594.html?industryid=47037
Analysts with Semico Research Corp. have identified a major sea change in the
way the memory market works: According to a Semico report released this week,
DRAM demand, and not DRAM capacity, now determines how much memory will be
shipped during any given quarter, while the growing popularity of NAND flash
due to its inclusion in products like Apple's iPhone is having a direct impact
on that demand.

"Sony To Sell PS3 Chip Production Lines To Toshiba"
http://www.eetimes.com/news/design/showArticle.jhtml?articleID=202404120
Sony Corp. will sell its production facilities for making microprocessors and
graphic chips used in its PlayStation 3 game console to Toshiba Corp., in its
latest step to focus on core operations. The price and other details have yet
to be set, Sony said, but sources close to the matter say the price is likely
to be in excess of 100 billion yen ($858 million).

"Embedded Vector Processor Is One Way to Tune Software-Defined Radios"
http://www.eetimes.com/news/design/showArticle.jhtml?articleID=202300882
The latest mobile phones already provide multiband and multimode operation on
cellular networks. They use an increasing number of communication pipes for
Wi-Fi connections, digital TV, digital audio broadcast and GPS satellite
reception, among other technologies. Coming soon are ultrawideband (UWB) for
wireless USB and WiMax for mobile Internet access.

"Wireless EEG System Powered by Body Heat"
http://www.chipdesignmag.com/display.php?articleId=1692&issueId=
IMEC has developed a 2-channel wireless EEG (electroencephalography or
monitoring of brain waves) system powered by a thermo-electric generator. It
uses the body heat dissipated naturally from the forehead. The wearable EEG
system operates completely autonomous and maintenance-free with no need to
change or recharge the batteries. This is a major advantage for body-worn
sensors, a key theme in the Human++ program within the Holst Centre.

"Groups Partner For OLEDS On Metal Substrates"
http://www.eetimes.com/news/semi/showArticle.jhtml?articleID=202403169
Organic light emitting diode (OLED) specialist Novaled AG (Dresden, Germany)
has teamed with ArcelorMittal, the world's largest steel maker, on a project
to
develop top-emitting OLEDs on flexible substrates for signage and lighting at
the steel group's research centre in Liege, Belgium.  The companies say they
foresee numerous applications for bendable OLEDs that use ArcelorMittal's
steel
plates as substrates. They suggest metallic substrates offer several
advantages
compared to standard glass-sheets.

"Printed Silicon To Challenge Organic Materials, Study Predicts"
http://www.eetimes.com/news/semi/showArticle.jhtml?articleID=202600569
Silicon nanocrystals and printed forms of silicon will have a strong impact on
conventional electronic circuits as well as on organic electronics, predicts
market researcher NanoMarkets LC. In a report, the company forecasts a market
volume of $2.5 billion by 2015.

"Design Tip: Model Instruments To Improve Signal Integrity Simulation"
http://www.eetimes.com/news/semi/showArticle.jhtml?articleID=202601693
When signal integrity simulations agree with measurement results, design
iterations can be performed in software with greater assurance, more accuracy
and with less cost than in doing multiple board turns. However, when it comes
to signal integrity design, getting measurements and simulation results to
agree takes special considerations.

"Under The Hood: NAND Flash Preps For 4 Bits Per Cell"
http://www.eetimes.com/news/semi/showArticle.jhtml?articleID=202600337
Single-chip 16-Gbit MLC NAND flash devices from 50-nanometer-class processes
were introduced in the first half of 2007. Adoption of MLC technology for NAND
flash has been a crucial factor in achieving bit growth of NAND flash devices.
As NAND flash manufacturers are tackling their next-generation process
challenges with 40-nm-class technology for further scaling of flash cell size,
efforts are being made to achieve more bits per flash cell with 4 bits per
cell.

"Step-down Devices up Efficiency"
http://eetimes.com/news/design/showArticle.jhtml?articleID=202400556
More often than not, power efficiency drives the market success or failure of
today's consumer electronics products. By dictating the length of a device's
operating life between charges, power efficiency plays a pivotal role in
users'
perceptions of a product's quality.

"Multicore Gives More Bang for the Buck"
http://eetimes.com/news/design/showArticle.jhtml?articleID=202300105
It has been clear for some time that a law of diminishing returns applies to
the advancement of conventional processor architectures.

"Ultrawideband SoCs Pose New Challenges to Manufacturers"
http://eetimes.com/news/design/showArticle.jhtml?articleID=202402838
Increased call for higher-quality wireless connectivity and capability to
deliever audio, video, and data makes higher demands on ATE industry because
of
wider bandwidth, higher frequencies and frequency hopping specifications.

"Panel Explores the Expanded Role of Test in DFM"
http://eetimes.com/news/design/showArticle.jhtml?articleID=202601617
What role does testing have in the design-for-manufacturing process? Plenty,
according to a panel of experts from industry and academia at the
International
Test Conference.

"Managing Network Traffic by Changing IP Network Delivery Model"
http://eetimes.com/news/design/showArticle.jhtml?articleID=202601979
Using service elements within devices can prioritize network traffic
efficiently and appropriately.

"ICs Ease Most Network Interface"
http://eetimes.com/news/design/showArticle.jhtml?articleID=202600349
Media Oriented Systems Transport (Most) is a networking standard enabling,
within an automobile, the seamless transport of digital audio, video and
packet-based data, along with real-time control information.


==============================================================================

What Is Multithreading and Multi-Core?
-------------------------------------------

Demystifying multithreading and multi-core
Kevin D. Kissell 

http://eetimes.com/news/design/showArticle.jhtml?articleID=202102042


==============================================================================

Paper Submission Deadlines:
----------------------------

SPL'08 - Southern Conference on Programmable Logic
Bariloche-Patagonia, Argentina
Mar 26-28, 2008
Deadline: Nov 1, 2007
http://www.splconf.org/

LATW'08 - Latin-American Test Workshop
Puebla, Mexico
Feb 17-20, 2008
Deadline: Nov 1, 2007
http://www-elec.inaoep.mx/latw2008/

DAC'08 - Design Automation Conference (sponsored by SIGDA)
Anaheim, CA
Jun 9-13, 2008
Deadline: Nov 19, 2007
http://www.dac.com/

NOCS'08 - Int'l Symposium on Networks-on-Chips
Newcastle, UK
Apr 7-11, 2008
Deadline: Nov 19, 2007
http://async.org.uk/nocs2008/

TAU'08 - Int'l Workshop on Timing Issues in the Specification
and Synthesis of Digital Systems (Sponsored by SIGDA)
Monterey, CA
Feb 25-26, 2008
Deadline: Nov 26, 2007
http://www.tauworkshop.com/

GLSVLSI'08 - Great Lakes Symposium on VLSI (Sponsored by SIGDA)
Orlando, FL
May 4-6, 2008
Deadline: Nov 30, 2007
http://www.glsvlsi.org/

ICAC'08 - Int'l Conference on Autonomic Computing
Chicago, IL
Jun 2-6, 2008
Deadline: Dec 1, 2007
http://www.acis.ufl.edu/~icac2008/

ISVLSI'08 - Annual Symposium on VLSI
Montpellier, France
Apr 7-9, 2008
Deadline: Dec 5, 2007
http://www.lirmm.fr/isvlsi2008/

SLIP'08 - Int'l Workshop on System Level Interconnect Prediction
Newcastle, UK
Apr 5-6, 2008
Deadline: Dec 7, 2007
http://www.sliponline.org/

EWME'08 - European Workshop on Microelectronics Education
Budapest, Hungary
May 28-30, 2008
Deadline: Dec 10, 2007
http://www.eet.bme.hu/new/index.php?option=com_content&task=view&id=129&Itemid=160

RCE'08 - Reconfigurable Computing Education
Montpellier, France
Apr 10, 2008
Deadline: Dec 15, 2007
http://helios.informatik.uni-kl.de/RCeducation08/

RFID'08 - Conference on RFID
Las Vegas, NV
Apr 16-17, 2008
Deadline: Dec 19, 2007
http://www.ieee-rfid.org/

==============================================================================

Upcoming Symposia, Conferences and Workshops:
---------------------------------------------

ICCAD'07 - Int'l Conference on Computer-Aided Design (sponsored by SIGDA)
San Jose, CA
Nov 4-8, 2007
http://www.iccad.com/

PDCS'07 - Int'l Conference on Parallel and Distributed Computing Systems
Cambridge, MA
Nov 19-21, 2007
http://www.iasted.org/conferences/home-590.html

ICST'07 - Int'l Conference on Sensing Technology
Palmerston North, New Zealand
Nov 26-28, 2007
http://icst.massey.ac.nz/

BIOCAS'07 - Biomedical Circuits and Systems Conference
London, UK
Nov 27-30, 2007
http://biocas.grm.polymtl.ca/

MICRO'07 - Int'l Symposium on Microarchitecture
Chicago, IL
Dec 1-5, 2007
http://www.microarch.org/micro40/

IP-SOC'07 - IP Based SoC Design
Grenoble, France
Dec 5-6, 2007
http://www.us.design-reuse.com/ipsoc2006/

ICPADS'07 - Int'l Conference on Parallel and Distributed Systems
Hsinchu, Taiwan
Dec 5-7, 2007
http://www.ccrc.nthu.edu.tw/icpads2007/

ICFPT'07 - Int'l Conference on Field-Programmable Technology
Kitakyushu, Japan
Dec 12-14, 2007
http://www.kameyama.ecei.tohoku.ac.jp/icfpt07/

EUC'07 - Int'l Conference on Embedded and Ubiquitous Computing
Taipei, Taiwan
Dec 17-20, 2007
http://www.cs.ccu.edu.tw/~shiwulo/euc07/

HiPC'07 - Int'l Conference on High Performance Computing
Goa, India
Dec 18-21, 2007
http://www.hipc.org/

ICM'07 - Int'l Conference on Microelectronics
Cairo, Egypt
Dec 29-31, 2007
http://www.ieee-icm.com/

VLSI'08 - Int'l Conference on VLSI Design (sponsored by SIGDA)
ES'08 - Int'l Conference on Embedded Systems
Hyderabad, India
Jan 4-8, 2008
http://vlsiconference.com/vlsi2008/

ASP-DAC'08 - Asia and South Pacific Design Automation Conference
(sponsored by SIGDA)
Seoul, Korea
Jan 21-24, 2008
http://www.aspdac.com/aspdac2008/

HiPEAC'08: Int'l Conference on High Performance Embedded Architectures &
Compilers
Goteborg, Sweden
Jan 27-29, 2008
http://www.hipeac.net/hipeac2008/

ISSCC'08 - Int'l Solid-State Circuits Conference
San Francisco, CA
Feb 3-7, 2008
http://isscc.org/isscc/

FPGA'08 Sixteenth ACM/SIGDA Int'l Symposium on Field-Programmable Gate Arrays
Monterey, California
February 24-26, 2008
http://www.isfpga.org

DATE'08 - Design Automation and Test in Europe (sponsored by SIGDA)
Munich, Germany
Mar 10-14, 2008
http://www.date-conference.com/

ISQED'08 - Int'l Symposium on Quality Electronic Design
San Jose, CA
Mar 17-19, 2008
http://www.isqed.org/

ASYNC'08: Int'l Symposium on Asynchronous Circuits and Systems
Newcastle, UK
Apr 7-11, 2008
http://async.org.uk/async2008/

ISPD'08 - Int'l Symposium on Physical Design (sponsored by SIGDA)
Portland, OR
Apr 13-16, 2008
http://www.ispd.cc/

RAW'08 - Reconfigurable Architectures Workshop
Miami, FL
Apr 14-15, 2008
http://www.ece.lsu.edu/vaidy/raw/

ISCAS'08 - Int'l Symposium on Circuits and Systems
Seattle, WA
May 18-21, 2008
http://iscas2008.org/

==============================================================================

Upcoming Funding Opportunities
------------------------------------

DOE

Broadening Participation and Collaborat
Deadline: September 30, 2008
http://www.science.doe.gov/grants/FAPN08-01.html


DOJ

Sensors and Surveillance Technology
Deadline: November 14, 2007
http://www.ojp.usdoj.gov/nij/funding.htm


ANS

Student Grant
Deadline: Continuous. The committee reviews and votes on the requests at its
June and November meetings.
http://rrsd.ans.org/grants.html


Microsoft

Microsoft Research New Faculty Fellowship Program
Deadline: November 19, 2007
http://research.microsoft.com/ur/us/nff/overview.aspx


IBM

IBM Herman Goldstine Fellowship
Deadline: January 5, 2008
http://domino.research.ibm.com/comm/research_projects.nsf/pages/goldstine.index.html


Postgraduate Opportunities

Postgraduate Research Participation at the Air Force Research Laboratory,
Materials Directorate, Tyndall Air Force Base
Deadline: Continuous
http://www.orau.gov/orise/edu/USAF/gi-pdRLMD.htm

Oak Ridge National Laboratory Advanced Short-Term Research Opportunity
Deadline: Continuous
http://www.orau.gov/orise/edu/ornl/gi-rgpdASTRO.htm


Faculty Opportunities

Faculty Research Participation at the U.S. Army Research Laboratory
Deadline: Continuous
http://see.orau.org/ProgramDescription.aspx?Program=10084


American Association of University Women

Summer/Short-Term Research Publication Grants
Deadline: November 15, 2007
http://www.aauw.org/education/fga//fellowships_grants/american.cfm

International Fellowships
Deadline: December 1, 2007
http://www.aauw.org/fga/fellowships_grants/international.cfm


ASEE

Naval Research Laboratory (NRL) Postdoctoral Fellowship Program
Deadline: Continuous. Applications are accepted on an ongoing basis.
http://www.asee.org/resources/fellowships/nrl/index.cfm

AAWU

International Fellowships
Deadline: December 1, 2007
http://www.aauw.org/fga/fellowships_grants/international.cfm


NIH

NLM Knowledge Management & Applied Informatics Grants
Deadline: May 25, 2007
          September 25, 2007
          January 25, 2008
http://grants1.nih.gov/grants/guide/pa-files/PAR-07-236.html


NASA

Broad Agency Announcement (BAA) - N61339-06-R-0107 (Joint ADL Co-Laboratory)
Deadline: Continuous
http://nawctsd.navair.navy.mil/EBusiness/BusOps/Acquisitions/Index.cfm?client=STRICOM

Applied Information Systems Research - NNH07ZDA001N-AISR
Deadline: To be announced (TBA)
http://nspires.nasaprs.com/external/solicitations/summary.do?method=init&solId=%7B89FBF877-DD5F-AC6E-DAB3-AE19504EA70D%7D&path=open


DOD

TRADOC FOC-03-06: Situational Understanding
Deadline: Continuous until August 26, 2009
https://abop.monmouth.army.mil/baas.nsf/1f6c118700adf19d85256d3d0051f9a2/31926e7d7d4b2e9285256f6d0056ce06?OpenDocument

Military Networking Technology for Global Information Exchange (GIE)
Deadline: Continuous until September, 2008
http://fedbizopps.cos.com/cgi-bin/getRec?id=20040909a11

Microsystems Technology Office-Wide BAA
Deadline: January 14, 2008
http://www.fbo.gov/spg/ODA/DARPA/CMO/BAA07%2D18/SynopsisP.html

ASEE-NRL Postdoctoral Fellowship Program
Deadline: Continuous
http://hroffice.nrl.navy.mil/jobs/postdoc.htm

Cognitive Technology Threat Warning System (CT2WS)
Deadline: April 11, 2008
http://fedbizopps.cos.com/cgi-bin/getRec?id=20070412a1

Warrior Systems Technologies - Body-Worn Systems, Hand Held Devices, and
Smart-Lightweight Electronic Components/Modules for Soldier Protection,
Knowledge Management and Cognitive Improvement
Deadline: Continuous. (April 1, 2007 ~ March 31, 2009)
https://www3.natick.army.mil/ssbaa.htm

Homeland Security (2.2.1) - N61339-02-R-0071
Deadline: Continuous. This BAA expires on January 30, 2008
http://www1.fbo.gov/spg/DON/NAVAIR/N61339/N61339-02-R-0071/Attachments.html

Microsystems Technology Office-Wide
Deadline: January 14, 2009
http://www.fbo.gov/spg/ODA/DARPA/CMO/BAA07-18/Attachments.html

SPINS in Semiconductors
Deadline: December 31, 2008
http://fundingopps.cos.com/alerts/57993

Artificial Intelligence Technologies
Deadline: December 31, 2008
http://heron.nrl.navy.mil/contracts/baa.htm

Quantum Information Science and Technology
Deadline: December 31, 2008
http://heron.nrl.navy.mil/contracts/0708baa/baa.htm

Young Investigator Program (YIP)
January 12, 2008
http://www.onr.navy.mil/sci_tech/3t/corporate/yip.asp

High Density Optical Memory
Deadline: Continuous
http://www.afosr.af.mil/pdfs/afosr_baa_2007_1.pdf

Quantum Electronic Solids
Deadline: Continuous
http://www.afosr.af.mil/pdfs/afosr_baa_2007_1.pdf

Distributed Intelligence
Deadline: Continuous
http://www.afosr.af.mil/pdfs/afosr_baa_2007_1.pdf

Enabling Technologies for Modeling and Simulation (BAA-03-12-IFKA)
Deadline: September 30, 2008
http://www.fbo.gov/spg/USAF/AFMC/AFRLRRS/BAA-03-12-IFKA/Modification%2005.html

Joint National Training Capability Broad Agency Announcement
Deadline: May 14, 2009
http://www.ntsc.navy.mil/Ebusiness/BusOps/Acquisitions/Index.cfm?RND=220990

BAA for Simulation and Training Technology R&D
Deadline: Continuous until December 31, 2010
http://www.ntsc.navy.mil/EBusiness/BusOps/Acquisitions/Index.cfm?RND=868451

Army Research Office (ARO) Broad Agency Announcement for Basic and Applied
Scientific Research (W911NF-07-R-0003)
Deadline: Continuous through September 30, 2011
http://www.arl.army.mil/www/default.cfm?Action=6&Page=8


NSF

Cyber-Enabled Discovery and Innovation   (CDI)
Deadline:   October 30, 2007 - November 30, 2007
            August 30, 2008 - September 30, 2008
            August 30 - September 30, Annually Thereafter

High Performance Computing Acquisition: Towards a Petascale Computing
Environment for Science and Engineering - NSF 05-625
Deadline: November 30, 2007
          November 28, 2008
http://www.nsf.gov/pubs/2005/nsf05625/nsf05625.htm

Cyber Trust - NSF 07-500
Deadline: November 14, 2007
http://www.nsf.gov/pubs/2007/nsf07500/nsf07500.htm

Foundations of Computing Processes and Artifacts (CPA) - NSF 07-587
Deadline: December 7, 2007
http://www.nsf.gov/pubs/2007/nsf07587/nsf07587.htm

Broadening Participation Research Initiation Grants in Engineering (BRIGE) -
NSF 07-589
Deadline: February 8, 2008
http://www.nsf.gov/pubs/2007/nsf07589/nsf07589.htm

Expeditions in Computing
Deadline: Letter of Intent Due Date(s) (required):
    November 05, 2007
    July 10, 2008
    July 10, Annually Thereafter
Preliminary Proposal Due Date(s) (required):
    December 30, 2007
    September 10, 2008
    September 10, Annually Thereafter
http://www.nsf.gov/pubs/2007/nsf07592/nsf07592.htm

Software for Real-World Systems (SRS) - NSF 07-599
Deadline: January 17, 2008
http://www.nsf.gov/pubs/2007/nsf07599/nsf07599.htm


Information and Intelligent Systems: Advancing Human-Centered Computing,
Information Integration and Informatics, and Robust Intelligence - NSF
07-577
Deadline: October 23, 2007 for Medium Projects
          November 19, 2007 for Large Projects
          December 10, 2007 for Small Projects
http://www.nsf.gov/pubs/2007/nsf07577/nsf07577.htm

Strategic Technologies for Cyberinfrastructure (STCI)
Deadline : August 9, 2007
           February 14, 2008
http://www.nsf.gov/funding/pgm_summ.jsp?pims_id=500066&org=NSF&sel_org=NSF&from=fund

Engineering Design (ED)
Deadline : October 1, 2007
           February 15, 2008
http://www.nsf.gov/funding/pgm_summ.jsp?pims_id=13340


==============================================================================

Call For Participation
-------------------

Annual ACM/SIGDA Dinner with Invited Speaker SIGDA Pioneer Achievement
Awardee, Gene Amdahl
Tuesday, November 6, 2007 at 7:30
Doubletree Hotel Donner Ballroom

Please join us for a unique event with computing pioneer Gene Amdahl on the
occasion of the 40th Anniversary of Amdahl's Law. We will listen to a historic
presentation on how Amdahl's law shaped the present computing landscape,
followed by "Can We Still Keep the Faith?"- a debate on how parallelism will
affect the multicore revolution. Don't miss this unique event, along with a
brief review of SIGDA's activities, and the winners of Monday's SIGDA
CADathlon. Dinner will be served.


==============================================================================

Call For Papers
-------------------

CALL FOR PAPERS - TAU 2008
ACM/IEEE International Workshop on Timing Issues in the Specification and
Synthesis of Digital Systems
http://www.tauworkshop.com

February 25-26, 2008
Monterey, California
Sponsored by ACM/SIGDA and IEEE/CAS

The TAU series of workshops provide an informal forum for practitioners and
researchers working  on temporal aspects of digital systems to disseminate
early work and engage in a free discussion  of ideas.  The fifteenth in the
TAU series, the TAU 2008 workshop invites submissions from all  areas related
to the timing properties of digital electronic systems, including but not
limited to:

Topics:
    Formal theories and methods
    System-level timing
    Transistor-level timing
    Circuit-level timing
    Sensitivity analysis
    Full custom design analysis
    Integrated functional-temporal analysis
    Incremental analysis
    Timing issues in low power design
    Power-delay trade-offs
    Adjacent line switching and coupling
    Delay models and metrics
    Layout impact on timing
    Timing-driven layout optimization
    Timing-driven synthesis and re-synthesis
    Circuit optimization
    Uncertainty-based analysis
    Incorporation of RETs in timing
    Reliability impact on performance
    Process & environmental variation models
    Statistical analysis techniques
    Clocking, synchronization, and skew
    Clock domains, static/dynamic logic
    Novel clocking schemes
    Special circuit families
    Asynchronous systems

IMPORTANT DATES   Submission deadline     November 26 2007
                  Acceptance notification January 11, 2008
                  Camera-ready paper due  February 11, 2008

SUBMISSION OF PAPERS
All papers must be submitted electronically. Details will be posted on the
web site  http://www.tauworkshop.com. Submissions are limited to 6 pages in
the double column proceedings format. TAU is a workshop aimed at fostering a
high level of professional interaction, not a conference.  Copies of papers
will be provided to the attendees, but the proceedings will not be published
by the ACM or the IEEE.  Therefore, accepted papers can still be submitted to
other conferences and journals.  The intent of the workshop is to encourage
the vigorous and unfettered discussion of the latest ideas in the field.

WORKSHOP ORGANIZATION:
General Chair:   Noel Menezes, Intel Corporation
Program Chair:   Frank Liu, IBM Corporation

==============================================================================

Call For Papers
-------------------

CALL FOR PAPERS SBCCI2008 (25 Years Edition) - CHIP IN THE PAMPA
21st Symposium on Integrated Circuits and Systems Design
September 1-4, 2008
Gramado,RS, Brazil

http://www.sbc.org.br/sbcci

SBCCI is a forum dedicated to integrated circuits and systems design, held
anually in Brazil. The 21st SBCCI will take place in Gramado (near Porto
Alegre), Brazil. The goal of the symposium is to bring together researchers
in the areas of computer-aided design, design and test of integrated circuits
and systems. The scope of the symposium includes technical sessions,
tutorials and panels, as well as exhibition and working group meetings. The
 best papers presented at the symposium will be invited to resubmit an
extended version to be considered for publication at the IEEE Design & Test
and at the JICS - Journal of Integrated Circuits and Systems.

Paper Submission:
SBCCI strongly encourages international submissions. Prospective authors
from around the world are invited to submit manuscripts in English for
consideration by the Program Committee. Manuscripts must contain a maximum of
10 pages, using 11-point font or larger and 1.5 or double spacing.
Submissions of manuscripts previously published by other conferences or
journals will not be considered by the program committee. The first page
should include the title, author(s) identification, author(s) affiliation,
and abstract. SBCCI submissions must be made electronically (in PDF format)
via the conference website. For proposals on special sessions, tutorials,
panels and tool demos, please email a short description to the program chairs
directly in advance of the submission deadline. For additional inquiries on
submissions, please contact the program chairs.

Final versions will be published as two-column, 6-page papers, following the
ACM Press guidelines. Authors should include the complete address, phone/fax
numbers and email address, and designate a contact person and a presenter.

Topics of interest include, but are not limited to:
- System level modeling and synthesis
- Hardware-software co-design and co-verification
- High-level and logic synthesis
- Physical design
- Verification, simulation, emulation and prototyping techniques
- Testability issues, design for test techniques
- Reconfigurable architectures and novel applications of FPGAs
- Design and modeling languages and applications
- Analog, Digital and mixed signal designs
- Embedded systems design and industrial applications
- Systems-on-chip, IP reuse and platform-based designs
- Low power tools and design techniques
- Micro-electromechanical systems
- Nanoelectronic circuits and nanoarchitectures


Important Dates:

Submission Deadline:                    March 24th,  2008
Notification of Acceptance:             May 14th, 2008
Camera-Ready Deadline:          June 6th,  2007

Location:
Gramado is a mountain resort in the state of Rio Grande do Sul.  It is one
of the top tourist destinations in Brazil, located 120km away from Porto
Alegre. Conference shuttles will run from Porto Alegre airport, at some
specific hours before and after the conference. This short shuttle ride can
be considered the first social event of the conference. Gramado is
characterized by  the influence of the German immigration in the region, and
by its excellent and diverse cuisine. With its bavarian architecture style,
Gramado is surrounded by beautiful mountains  and  it provides  a great
environment for holding conferences and meetings. The waterfall of  .Caracol.
is a must to see location, just few km from Gramado. The .Green Canyons. of
Itaimbezinho and Fortaleza are also wonderful locations for a one day tour
before or after the conference.

SBCCI2008 will be co-located with SBMicro2008 - The 23rd Symposium on
Microelectronics Technology and Devices.

General Chair:
Marcelo Lubaszewski,
UFRGS, Brazil
luba@ece.ufrgs.br

Program Chairs:
Michel Renovell,
LIRMM, France
renovell@lirmm.fr

Rajesh Gupta,
UCSD, USA
rgupta@ucsd.edu


Sponsored by:
SBC - BRAZILIAN COMPUTER SOCIETY
SBMicro - BRAZILIAN MICROELECTRONICS SOCIETY
IEEE CIRCUITS & SYSTEMS SOCIETY
ACM  SIGDA
Co-Sponsored by:
IFIP WG10.5 - International Federation for Information Processing
Organized by:
UFRJ - Universidade Federal do Rio de Janeiro
Support by:
CNPq, CAPES, FINEP, FAPERJ
Published by:
ACM PRESS

==============================================================================
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